Semiconductor Equipment Foam Metal Solutions

High-purity, low-particulate foam metals engineered specifically for vacuum systems, thermal management, and vibration control in advanced semiconductor manufacturing equipment. Certified for cleanroom applications and compatible with ASML, Lam Research, Applied Materials, and Tokyo Electron tool requirements.

Semiconductor-Grade Purity
Low Particle Generation
Thermal Management
Chemical Compatibility
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Compatible with Leading Semiconductor Equipment

Our foam metal solutions are engineered to meet the stringent requirements of top semiconductor equipment manufacturers.

Note: Our materials are supplied to equipment manufacturers and their component suppliers, not directly to fabs.

Semiconductor Equipment Applications

Engineered for critical subsystems in advanced semiconductor manufacturing tools.

Vacuum & Exhaust Systems

Primary Applications:

  • Vacuum exhaust silencers
  • Pump buffer components
  • Gas dispersion elements
  • Plasma etch tailgas handling

Key Materials: High-purity nickel foam, stainless steel foam

Critical Requirements: Ultra-low particle generation, chemical resistance, controlled outgassing

Thermal Management

Primary Applications:

  • EUV power module cooling
  • RF power cabinet heat spreaders
  • Control electronics thermal management
  • Liquid-cooled heat exchangers

Key Materials: Ultra-clean copper foam, nickel-copper composites

Critical Requirements: High thermal conductivity, minimal particulate shedding

Vibration Damping

Primary Applications:

  • Equipment base isolation
  • Seismic protection structures
  • Micro-vibration control
  • Composite damping layers

Key Materials: Foam metal composites, encapsulated structures

Critical Requirements: Energy absorption >70%, minimal creep, long-term stability

Emission Control

Primary Applications:

  • Acidic gas scrubber carriers
  • VOC catalytic substrates
  • Particulate filtration media
  • Sub-fab exhaust treatment

Key Materials: Corrosion-resistant alloys, surface-treated foams

Critical Requirements: Chemical resistance, high surface area, structural integrity

Product Series for Semiconductor Equipment

Engineered foam metal solutions categorized by application area.

Vacuum System Solutions (VSS Series)

VSS-100

Vacuum Exhaust Silencer Foam

High-purity nickel foam for vacuum pump exhaust silencers in EUV and plasma etch tools.

  • Material: Ni 99.9% pure
  • Porosity: 85-92% (customizable)
  • PPI: 150-250
  • Outgassing: <1×10⁻⁶ Torr·L/s·cm²
  • Particle count: <100 particles/m³ (>0.3μm)

Applications: ASML EUV, Lam Research etch, Applied Materials CVD tools

VSS-200

Stainless Steel Vacuum Foam

Semiconductor-grade stainless steel foam for corrosive gas handling in vacuum systems.

  • Material: SUS 316L electropolished
  • Chemical resistance: Cl₂, HBr, SF₆, NF₃
  • Surface roughness: <0.5 μm Ra
  • Temperature range: -200°C to +500°C
  • Certification: ASTM E595, ISO 14644-1

Applications: Plasma etch exhaust, vacuum pump buffers, gas dispersion

Thermal Management (TM Series)

TM-300

High-Conductivity Copper Foam

Ultra-clean copper foam for high-power electronics cooling in semiconductor equipment cabinets.

  • Material: Cu 99.99% pure
  • Thermal conductivity: >200 W/m·K
  • Porosity: 90-95%
  • Surface treatment: Electropolished
  • Particulate shedding: <50 particles/cm²

Applications: EUV power modules, RF generator cooling, control cabinet heat spreaders

TM-400

Liquid Cooling Foam Core

Closed-cell foam metal structures for liquid-cooled heat exchangers in high-power applications.

  • Material: Nickel-copper composite
  • Heat transfer coefficient: >5000 W/m²·K
  • Pressure drop: <0.5 bar at 5 L/min
  • Leak rate: <1×10⁻⁸ mbar·L/s
  • Working fluid: DI water, Galden, Fluorinert

Applications: Liquid-cooled heat sinks, cold plates, immersion cooling

Vibration Control (VC Series)

VC-500

Equipment Base Damping Composite

Foam metal-elastomer composite for vibration isolation in precision semiconductor tools.

  • Structure: Encapsulated foam metal core
  • Damping factor: >0.15 at 10-100 Hz
  • Load capacity: 500-5000 kg
  • Creep: <2% after 1000 hours
  • Temperature stability: -40°C to +80°C

Applications: Lithography tool bases, metrology equipment, precision stages

VC-600

Seismic Isolation Foam Structure

High-damping foam metal structures for earthquake protection of semiconductor equipment.

  • Material: Stainless steel foam composite
  • Energy absorption: >70% at 0.3-30 Hz
  • Displacement capacity: ±100 mm
  • Lifetime: >50 years design life
  • Certification: IBC, ASCE 7 compliant

Applications: Fab earthquake protection, seismic bracing, equipment anchoring

Technical Specifications & Requirements

Critical parameters for semiconductor equipment applications.

Parameter Specification Test Method Semiconductor Relevance
Particle Generation <100 particles/m³ (>0.3μm) ISO 14644-1 Class 1 Critical for EUV and advanced node tools where particles cause defects
Outgassing Rate <1×10⁻⁶ Torr·L/s·cm² ASTM E595 Prevents contamination in high-vacuum chambers (EUV, PVD, ALD)
Surface Roughness (Ra) <0.5 μm ISO 4287 Reduces particle trapping and improves gas flow characteristics
Chemical Compatibility Resistant to Cl₂, HBr, SF₆, NF₃ ASTM G31 Essential for etch and CVD tool exhaust systems with corrosive gases
Thermal Conductivity >200 W/m·K (Cu foam) ASTM C518 Cools high-power electronics in EUV, etch, and deposition tools
Vibration Damping >70% energy absorption ASTM E756 Protects sensitive equipment from micro-vibrations and seismic events
Porosity Control 85-95% ±2% ASTM D6226 Consistent fluid/gas flow characteristics for vacuum and cooling systems
Pore Size Distribution 100-500 PPI ±10% ASTM E1294 Controlled for specific pressure drop and surface area requirements
Mechanical Strength 15-45 MPa compressive ASTM C365 Maintains structural integrity under vacuum and mechanical loads
Cleaning Compatibility Compatible with standard semiconductor cleaning processes SEMI Standards Allows integration with existing fab maintenance protocols

Quality & Certifications

Manufactured under strict quality control protocols for semiconductor applications.

ISO 14644-1 Cleanroom Standards

Manufactured and packaged in Class 1000 cleanroom environment with particle monitoring and control protocols.

Applications: All semiconductor-grade foam metals

ASTM E595 Outgassing Testing

All materials tested for total mass loss (TML) and collected volatile condensable materials (CVCM) to meet vacuum system requirements.

Applications: Vacuum system components

Material Traceability

Full material traceability from raw material to finished product with certification documentation for each batch.

Applications: Critical equipment components

Semiconductor Equipment Inquiry

For technical specifications, samples, or custom engineering solutions.

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Application Details

Technical Requirements

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Frequently Asked Questions

What particle count standards do your semiconductor-grade foams meet?
Our semiconductor-grade foam metals are manufactured and packaged in Class 1000 cleanroom environments and meet ISO 14644-1 Class 1 particle standards. Typical particle counts are <100 particles/m³ for particles >0.3μm. We can provide particle count testing reports for specific materials upon request.
Are your materials compatible with semiconductor cleaning processes?
Yes, our foam metals are designed to be compatible with standard semiconductor cleaning processes including solvent cleaning, ultrasonic cleaning, and plasma cleaning. We provide specific cleaning protocols for each material type and can customize surface treatments for compatibility with your specific cleaning requirements.
Do you provide material certification and traceability?
Yes, we provide full material certification and traceability for all semiconductor-grade materials. Each batch includes certification documentation with material composition, mechanical properties, cleanliness data, and outgassing test results. We maintain complete traceability from raw material to finished product.
Can you develop custom alloys for specific chemical compatibility?
Yes, our engineering team specializes in developing custom foam metal alloys for specific chemical environments. We have experience with corrosive gas compatibility (Cl₂, HBr, SF₆, NF₃) and can develop materials with specific surface treatments or alloy compositions to meet your exact requirements.
What is your lead time for semiconductor-grade samples?
For standard semiconductor-grade materials, we can provide samples within 2-3 weeks. Custom formulations or specific testing requirements may extend this to 4-6 weeks. We offer expedited sampling for urgent development programs. All samples are provided with full technical documentation.
Do you work with equipment manufacturers directly or through their suppliers?
We work with both semiconductor equipment manufacturers directly and their tier 1/2 component suppliers. Our materials are designed to be integrated into sub-assemblies by component manufacturers or used directly by equipment OEMs. We maintain strict confidentiality agreements and can work within your supply chain structure.

Ready to Engineer Your Semiconductor Solution?

Contact our semiconductor engineering team for technical specifications, samples, or custom development.

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